Formation of titanium silicide on ion-implanted silicon

Y. E. Gilboa*, M. Eizenberg

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

The formation of TiSi2 was compared over samples implanted with arsenic and BF2 at different doses and annealed at different temperatures and lengths of time in a rapid thermal process. Measurements were done to determine the composition and thickness of the silicide formed. The composition was determined from Auger electron spectroscopy, Rutherford backscattering spectroscopy, and transmission electron microscopy. The phase formation of the silicide was characterized by X-ray diffraction. Dopant redistribution was studied using secondary ion mass spectroscopy. Comparing the results of the different implant doses we found that the amount of silicide formed over heavily doped Si at formation temperatures of 600 °C to 650 °C was reduced compared to undoped Si. At formation temperatures above 750 °C the implanted dose and species did not significantly affect the amount of silicide formation. Above 750 °C the TiSi2 structure was found to be the C54 phase. Arsenic was found to diffuse into the Ti silicide layer in a diffusion controlled process. Boron was found to accumulate at the Ti silicide interfaces both with the substrate and with the surface TixOyNz layer.

Original languageEnglish
Pages (from-to)253-258
Number of pages6
JournalMaterials Research Society Symposium Proceedings
Volume470
DOIs
StatePublished - 1997
Externally publishedYes
EventProceedings of the 1997 MRS Spring Meeting - San Francisco, CA, USA
Duration: 1 Apr 19974 Apr 1997

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