Daniel Qi Tan

Daniel Qi Tan

Professor

    Calculated based on number of publications stored in Pure and citations from Scopus
    1987 …2023

    Research activity per year

    Network

    Dwight Viehland

    • University of Illinois at Urbana-Champaign
    • NUWC
    • Naval Undersea Warfare Center
    • NUWC
    • The American Ceramic Society
    • Johnson Matthey Electronics
    • University of Illinois at Urbana-Champaign

    External person

    Patricia C. Irwin

    • General Electric

    External person

    Yang Cao

    • General Electric
    • University of Connecticut

    External person

    Guanghui Song

    • Technion-Israel Institute of Technology
    • Guangdong Provincial Key Laboratory of Materials and Technologies for Energy Conversion

    External person

    Z. Xu

    • University of Illinois at Urbana-Champaign
    • University of Illinois at Urbana-Champaign

    External person

    Jie Fang Li

    • University of Illinois at Urbana-Champaign
    • Johnson Matthey Electronics
    • University of Illinois at Urbana-Champaign

    External person

    Q. Chen

    • General Electric

    External person

    Yu Wang

    • Michigan Technical University
    • Michigan Technological University
    • Michigan Technological University

    External person

    Yair Ein-Eli

    • Technion-Israel Institute of Technology

    External person

    T. S. Kê

    • CAS - Institute of Solid State Physics

    External person

    Xiaomei Fang

    • General Electric

    External person

    Pritom J. Bora

    • Technion-Israel Institute of Technology
    • Indian Institute of Science Bangalore

    External person

    Fushen Lu

    • Shantou University
    • Guangdong Laboratory of Chemistry and Fine Chemical Industry Jieyang Center
    • Jieyang Center

    External person

    Christophe Garet

    • Bollore, Inc
    • Bollore, Inc

    External person

    T. S. Kê(Ge Tingsui)

    • CAS - Institute of Solid State Physics

    External person

    Jianguo Chen

    • Shanghai University

    External person

    Jianxing Li

    • Johnson Matthey Electronics

    External person

    Mark Rumler

    • Dearborn Electronics, Inc
    • Inc.

    External person

    Li Lei

    • Technion-Israel Institute of Technology

    External person

    Mark Carter

    • Dearborn Electronics, Inc
    • Inc.

    External person

    Yingneng Zhou

    • General Electric

    External person

    Norberto Silvi

    • General Electric

    External person

    Karim Younsi

    • General Electric

    External person

    Chaoxin Chen

    • Technion-Israel Institute of Technology

    External person

    Liangsheng Hu

    • Shantou University
    • Hong Kong Polytechnic University
    • Guangdong Laboratory of Chemistry and Fine Chemical Industry Jieyang Center
    • Jieyang Center

    External person

    Jinrong Cheng

    • Shanghai University

    External person

    Xiang Peng

    • City University of Hong Kong

    External person

    John Krahn

    • General Electric

    External person

    T. S. KÊC (Tingsui Ge)

    • CAS - Institute of Solid State Physics
    • University of Science and Technology of China

    External person

    Xiangshang Xiao

    • Technion-Israel Institute of Technology

    External person

    Baojin Chu

    • Pennsylvania State University

    External person

    D. Z. Ma

    • University of Science and Technology of China

    External person

    V. S. Venkataramani

    • General Electric

    External person

    T. R. Suresh Kumar

    • Vellore Institute of Technology
    • Indian Institute of Science Bangalore

    External person

    Hong Xia

    • Shantou University
    • Guangdong Laboratory of Chemistry and Fine Chemical Industry Jieyang Center
    • Jieyang Center

    External person

    Han Chen

    • Technion-Israel Institute of Technology

    External person

    Chang Liu

    • Technion-Israel Institute of Technology

    External person

    G. Pilania

    • University of Connecticut

    External person

    Lili Zhang

    • General Electric

    External person

    Q. F. Fang

    • CAS - Institute of Solid State Physics

    External person

    Junqi Sun

    • Technion-Israel Institute of Technology

    External person

    Enis Tuncer

    • General Electric

    External person

    Xiangshang Xiao

    • Technion-Israel Institute of Technology

    External person

    Jie Fang Li

    • University of Illinois at Urbana-Champaign
    • Naval Undersea Warfare Center
    • Johnson Matthey Electronics

    External person

    Jian Guo

    • Shanghai University

    External person

    Zhi Hong Liu

    • Guilin University of Technology
    • Hunan University

    External person

    R. Ramprasad

    • University of Connecticut

    External person

    Zhaoxi Liu

    • Technion-Israel Institute of Technology

    External person

    Paul K. Chu

    • City University of Hong Kong

    External person

    Jianxing Li

    • Honey Well Electronic Materials
    • Honeywell

    External person

    Avigdor Zangvil

    • University of Illinois at Urbana-Champaign

    External person

    Jianxing Li

    • Honeywell

    External person

    Yongmei M. Jin

    • Michigan Technological University
    • Michigan Technological University

    External person

    Junyan Chen

    • Technion-Israel Institute of Technology

    External person

    Wei Zhang

    • General Electric

    External person

    Liwei D. Geng

    • Michigan Technological University
    • Michigan Technological University

    External person

    Xin Chen

    • CAS - Institute of Process Engineering
    • Qiqihar University

    External person

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