Thermal stability and electrical properties of Zr/Si1-x-yGexCy contacts after rapid thermal annealing

V. Aubry-Fortuna*, A. Eyal, O. Chaix-Pluchery, M. Barthula, F. Meyer, M. Eizenberg

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

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In this work, we have investigated the reaction between Zr and SiGeC alloys. Annealings have been performed in a rapid thermal annealing (RTA) furnace at temperatures ranging from 400 to 800°C for 5 min. The reaction of the metal with the alloy has been investigated by x-ray diffraction and Rutherford backscattering spectrometry. Four crystal x-ray diffraction was performed to measure the residual strain in the epilayer. The analyses indicate that the C49-Zr(Si1-xGex)2 is the final phase of the reaction. For all compositions examined (from 0% up to 33% of Ge), the C49 film has the same Ge content as in the as-deposited Si1-x-yGexCy layer and no Ge segregation has occured. In addition, this thermal treatment leads to only a small strain relaxation in the unreacted epilayer. The presence of C does not modify the reaction and it prevents any strain relaxation. Schottky barrier height measurements have been performed on p-type layers. RTA leads to a slight decrease of the barrier without any degradation of the contact. The C49 film presents a resistivity of about 80 μcm. These results indicate that Zr may be a good candidate for contacts on IV-IV alloys in terms of thermal stability.

Original languageEnglish
Pages (from-to)1248-1250
Number of pages3
JournalApplied Physics Letters
Issue number9
StatePublished - 1998
Externally publishedYes


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