Abstract
Atomic layer deposited titanium dioxide (ALD-TiO2) has emerged as an effective protection layer for highly efficient semiconductor anodes which are normally unstable under the potential and pH conditions used to oxidize water in a photoelectrochemical cell. The failure modes of silicon anodes coated with an Ir/IrOx oxygen evolution catalyst layer are investigated, and poor catalyst/substrate adhesion is found to be a key factor in failed anodes. Quantitative measurements of interfacial adhesion energy show that the addition of TiO2 significantly improves reliability of anodes, yielding an adhesion energy of 6.02 ± 0.5 J/m2, more than double the adhesion energy measured in the absence of an ALD-TiO2 protection layer. These results indicate the importance of catalyst adhesion to an interposed protection layer in promoting operational stability of high efficiency semiconducting anodes during solar-driven water splitting.
Original language | English |
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Pages (from-to) | 37103-37109 |
Number of pages | 7 |
Journal | ACS applied materials & interfaces |
Volume | 10 |
Issue number | 43 |
DOIs | |
State | Published - 31 Oct 2018 |
Externally published | Yes |
Keywords
- adhesion
- atomic layer deposition
- failure mode
- isotope
- water oxidation