Abstract
Screen printing is a potential technique for mass-production of printed electronics; however, improvement in printing resolution is needed for high integration and performance. In this study, screen printing of highly loaded silver ink (77 wt %) on polyimide films is studied using fine-scale silicon stencils with openings ranging from 5 to 50 ωm wide. This approach enables printing of high-resolution silver lines with widths as small as 22 μm. The printed silver lines on polyimide exhibit good electrical properties with a resistivity of 5.5 × 10-6 ω cm and excellent bending tolerance for bending radii greater than 5 mm (tensile strains less than 0.75%).
Original language | English |
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Pages (from-to) | 12619-12624 |
Number of pages | 6 |
Journal | ACS applied materials & interfaces |
Volume | 7 |
Issue number | 23 |
DOIs | |
State | Published - 17 Jun 2015 |
Externally published | Yes |
Keywords
- plastic substrates
- printed electronics
- screen printing
- silicon stencils
- silver ink