Screen Printing of Highly Loaded Silver Inks on Plastic Substrates Using Silicon Stencils

Woo Jin Hyun, Sooman Lim, Bok Yeop Ahn, Jennifer A. Lewis, C. Daniel Frisbie*, Lorraine F. Francis

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

91 Scopus citations

Abstract

Screen printing is a potential technique for mass-production of printed electronics; however, improvement in printing resolution is needed for high integration and performance. In this study, screen printing of highly loaded silver ink (77 wt %) on polyimide films is studied using fine-scale silicon stencils with openings ranging from 5 to 50 ωm wide. This approach enables printing of high-resolution silver lines with widths as small as 22 μm. The printed silver lines on polyimide exhibit good electrical properties with a resistivity of 5.5 × 10-6 ω cm and excellent bending tolerance for bending radii greater than 5 mm (tensile strains less than 0.75%).

Original languageEnglish
Pages (from-to)12619-12624
Number of pages6
JournalACS applied materials & interfaces
Volume7
Issue number23
DOIs
StatePublished - 17 Jun 2015
Externally publishedYes

Keywords

  • plastic substrates
  • printed electronics
  • screen printing
  • silicon stencils
  • silver ink

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