Rapid thermal annealing of Zr/SiGeC contacts

M. Barthula*, V. Aubry-Fortuna, F. Meyer, O. Chaix-Pluchery, A. Eyal, M. Eizenberg, P. Warren

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations


In this work, the effect of rapid thermal annealing (400-800°C, 5 min) on the electrical properties of Zr/ Si1-x-yGexCy contacts was investigated. Previously, we have shown that the reaction of Zr with SiGeC leads to the final compound C49-Zr(Si1-zGez)2, with z = x for all compositions examined and that no Ge-segregation is detected. After the reaction, only a small strain relaxation is observed in the unreacted SiGe epilayer, while the strain is totally preserved in the SiGeC one. Schottky barrier heights have been studied as a function of the annealing temperature. RTA leads to a decrease of the barrier for both n- and p-type. The decrease of the barrier height with reverse voltage is always well described by the thermionic emission. Nevertheless, the slight increase of the standard deviation, deducted from barrier height histograms, may show that few interface defects are created during annealing.

Original languageEnglish
Pages (from-to)263-266
Number of pages4
JournalMaterials Science in Semiconductor Processing
Issue number3-4
StatePublished - Dec 1998
Externally publishedYes


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