Optimization of upcycling of Ti-6Al-4V swarf

Yuanshen Qi*, Ilana B. Timokhina, Alexandra Shekhter, Khan Sharp, Rimma Lapovok

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

10 Scopus citations


Application of Ti alloys in the aerospace and biomedical industries is on the incline which typically results in more than 80% of Ti alloy in swarf. Hence, developing innovative processes to recycle Ti alloys swarf is becoming an increasingly valuable issue. Equal-channel angular pressing (ECAP) compaction with a series of post-deformation heat treatments were designed and investigated in this study as method to upcycle Ti swarf. After a single ECAP compaction process, the compacts possessed near 99% theoretical density and annealing treatment further increased the density and enhanced the bonding between chips. The microstructural and textural evolution of α and β phases after ECAP and annealing was examined. Upcycling of fine-grained Ti-6Al-4V compacts with minimum crystallographic texture intensity were produced from swarf using economically-viable way.

Original languageEnglish
Pages (from-to)853-864
Number of pages12
JournalJournal of Materials Processing Technology
StatePublished - May 2018
Externally publishedYes


  • Annealing
  • Equal-channel angular pressing
  • Microstructure-property relationship
  • Recrystallization
  • Swarf
  • Ti-6Al-4V


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