Inkjet Printing: A Cheap and Easy-to-Use Alternative to Wire Bonding for Academics

Yingwen Liu; Kaichen Zhu; Fei Hui; Bin Yuan; Chenhui Zhang; Yinchang Ma; Xixiang Zhang; Mario Lanza

doi:10.1002/crat.202100210

Inkjet Printing: A Cheap and Easy-to-Use Alternative to Wire Bonding for Academics

Yingwen Liu, Kaichen Zhu, Fei Hui, Bin Yuan, Chenhui Zhang, Yinchang Ma, Xixiang Zhang, Mario Lanza^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Abstract

Many groups in academia are having problems patterning interconnections to small electrodes using wire bonding, including metal melting and detachment of previously bonded wires. It is a fact that the industry makes reliable wire bonding using automatic setups and expert personnel, and also that many groups in academia can do wire bonding reliably. However, it is also true that wire bonding is much more problematic than other techniques often employed to pattern interconnections, such as lithography or inkjet printing. In this article, the contact resistance and maximum currents driven by metallic interconnections patterned via wire bonding, lithography, and inkjet printing are compared. It is concluded that interconnections patterned via inkjet printing meet the requirements of many types of experiments, and that inkjet printing is a very cheap and easy-to-use alternative to wire bonding, especially attractive for academics.

Original language	English
Article number	2100210
Journal	Crystal Research and Technology
Volume	57
Issue number	3
DOIs	https://doi.org/10.1002/crat.202100210
State	Published - Mar 2022
Externally published	Yes

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title = "Inkjet Printing: A Cheap and Easy-to-Use Alternative to Wire Bonding for Academics",

abstract = "Many groups in academia are having problems patterning interconnections to small electrodes using wire bonding, including metal melting and detachment of previously bonded wires. It is a fact that the industry makes reliable wire bonding using automatic setups and expert personnel, and also that many groups in academia can do wire bonding reliably. However, it is also true that wire bonding is much more problematic than other techniques often employed to pattern interconnections, such as lithography or inkjet printing. In this article, the contact resistance and maximum currents driven by metallic interconnections patterned via wire bonding, lithography, and inkjet printing are compared. It is concluded that interconnections patterned via inkjet printing meet the requirements of many types of experiments, and that inkjet printing is a very cheap and easy-to-use alternative to wire bonding, especially attractive for academics.",

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AU - Zhang, Chenhui

AU - Ma, Yinchang

AU - Zhang, Xixiang

AU - Lanza, Mario

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AB - Many groups in academia are having problems patterning interconnections to small electrodes using wire bonding, including metal melting and detachment of previously bonded wires. It is a fact that the industry makes reliable wire bonding using automatic setups and expert personnel, and also that many groups in academia can do wire bonding reliably. However, it is also true that wire bonding is much more problematic than other techniques often employed to pattern interconnections, such as lithography or inkjet printing. In this article, the contact resistance and maximum currents driven by metallic interconnections patterned via wire bonding, lithography, and inkjet printing are compared. It is concluded that interconnections patterned via inkjet printing meet the requirements of many types of experiments, and that inkjet printing is a very cheap and easy-to-use alternative to wire bonding, especially attractive for academics.

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Inkjet Printing: A Cheap and Easy-to-Use Alternative to Wire Bonding for Academics

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