Improved diffusion barriers for copper metallization obtained by passivation of grain boundaries in electroless deposited cobalt-based films

A. Kohn*, M. Eizenberg, Y. Shacham-Diamand

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Fingerprint

Dive into the research topics of 'Improved diffusion barriers for copper metallization obtained by passivation of grain boundaries in electroless deposited cobalt-based films'. Together they form a unique fingerprint.

Physics & Astronomy