Abstract
A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the channels by capillary forces. These features serve as a seed layer for copper deposition inside the channels via electroless plating. Highly conductive wires (>50% bulk metal) with minimum line width and spacing of 2 and 4 μm, respectively, and an aspect ratio of 0.6 are obtained. The embedded wires exhibit good mechanical flexibility, with minimal degradation in electrical performance after thousands of bending cycles.
Original language | English |
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Pages (from-to) | 1841-1847 |
Number of pages | 7 |
Journal | ACS applied materials & interfaces |
Volume | 7 |
Issue number | 3 |
DOIs | |
State | Published - 28 Jan 2015 |
Externally published | Yes |
Keywords
- copper electroless plating
- flexible electronics
- high-resolution metal lines
- imprint lithography
- inkjet printing