Enhanced Discharged Energy Density in Polyetherimide Composites by Boron Nitride/Aluminum Nitride Hybrid Fillers

Xudong Wu; Shiyi Gao; Xin Wu; Shuo Zhang; Zhijun Cao; Daniel Q. Tan

doi:10.1109/ICEPT52650.2021.9568070

Enhanced Discharged Energy Density in Polyetherimide Composites by Boron Nitride/Aluminum Nitride Hybrid Fillers

Xudong Wu, Shiyi Gao, Xin Wu, Shuo Zhang, Zhijun Cao, Daniel Q. Tan

Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Flexible dielectric polymer composites occupy a significant position in electronic devices. However, many investigations focus on complicated synthetic methods to enhance the energy density of dielectrics. Developing simple and feasible strategy is meaningful and urgent for their acceptance to various applications. Herein, we utilize the high thermal conductivity and electrical insulation characteristic of Boron nitride and Aluminum nitride (BN/AIN) as the hybrid fillers for polyetherimide (PEl) matrix to increase dielectric constant and breakdown strength. This combination resulted in a high discharged energy density of 8.39 J/cm³ at 500 kV/mm with a high efficiency of 90.5% at a low filler fraction. This strategy provides a feasible option for a scalable manufacturing of high performance composite films in the future.

Original language	American English
Title of host publication	2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
Publisher	IEEE Canada
Pages	1-3
Number of pages	3
ISBN (Print)	978-1-6654-1392-3
DOIs	https://doi.org/10.1109/ICEPT52650.2021.9568070
State	Published - 17 Sep 2021
Event	2021 22nd International Conference on Electronic Packaging Technology (ICEPT) - Xiamen, China Duration: 14 Sep 2021 → 17 Sep 2021

Conference

Conference	2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
Period	14/09/21 → 17/09/21

Keywords

Fabrication
Insulation
Dielectric constant
Boron
Electric breakdown
Films
Transfer functions

Access to Document

10.1109/ICEPT52650.2021.9568070

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9568070

Cite this

@inproceedings{8894f83bd4e3498c9222654c984a3cad,

title = "Enhanced Discharged Energy Density in Polyetherimide Composites by Boron Nitride/Aluminum Nitride Hybrid Fillers",

abstract = "Flexible dielectric polymer composites occupy a significant position in electronic devices. However, many investigations focus on complicated synthetic methods to enhance the energy density of dielectrics. Developing simple and feasible strategy is meaningful and urgent for their acceptance to various applications. Herein, we utilize the high thermal conductivity and electrical insulation characteristic of Boron nitride and Aluminum nitride (BN/AIN) as the hybrid fillers for polyetherimide (PEl) matrix to increase dielectric constant and breakdown strength. This combination resulted in a high discharged energy density of 8.39 J/cm3 at 500 kV/mm with a high efficiency of 90.5% at a low filler fraction. This strategy provides a feasible option for a scalable manufacturing of high performance composite films in the future.",

keywords = "Fabrication, Insulation, Dielectric constant, Boron, Electric breakdown, Films, Transfer functions",

author = "Xudong Wu and Shiyi Gao and Xin Wu and Shuo Zhang and Zhijun Cao and Tan, {Daniel Q.}",

year = "2021",

month = sep,

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doi = "10.1109/ICEPT52650.2021.9568070",

language = "American English",

isbn = "978-1-6654-1392-3",

pages = "1--3",

booktitle = "2021 22nd International Conference on Electronic Packaging Technology (ICEPT)",

publisher = "IEEE Canada",

address = "Canada",

note = "2021 22nd International Conference on Electronic Packaging Technology (ICEPT) ; Conference date: 14-09-2021 Through 17-09-2021",

}

Wu, X, Gao, S, Wu, X, Zhang, S, Cao, Z & Tan, DQ 2021, Enhanced Discharged Energy Density in Polyetherimide Composites by Boron Nitride/Aluminum Nitride Hybrid Fillers. in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)., 9568070, IEEE Canada, pp. 1-3, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 14/09/21. https://doi.org/10.1109/ICEPT52650.2021.9568070

Enhanced Discharged Energy Density in Polyetherimide Composites by Boron Nitride/Aluminum Nitride Hybrid Fillers. / Wu, Xudong; Gao, Shiyi; Wu, Xin et al.
2021 22nd International Conference on Electronic Packaging Technology (ICEPT). IEEE Canada, 2021. p. 1-3 9568070.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Enhanced Discharged Energy Density in Polyetherimide Composites by Boron Nitride/Aluminum Nitride Hybrid Fillers

AU - Wu, Xudong

AU - Gao, Shiyi

AU - Wu, Xin

AU - Zhang, Shuo

AU - Cao, Zhijun

AU - Tan, Daniel Q.

PY - 2021/9/17

Y1 - 2021/9/17

N2 - Flexible dielectric polymer composites occupy a significant position in electronic devices. However, many investigations focus on complicated synthetic methods to enhance the energy density of dielectrics. Developing simple and feasible strategy is meaningful and urgent for their acceptance to various applications. Herein, we utilize the high thermal conductivity and electrical insulation characteristic of Boron nitride and Aluminum nitride (BN/AIN) as the hybrid fillers for polyetherimide (PEl) matrix to increase dielectric constant and breakdown strength. This combination resulted in a high discharged energy density of 8.39 J/cm3 at 500 kV/mm with a high efficiency of 90.5% at a low filler fraction. This strategy provides a feasible option for a scalable manufacturing of high performance composite films in the future.

AB - Flexible dielectric polymer composites occupy a significant position in electronic devices. However, many investigations focus on complicated synthetic methods to enhance the energy density of dielectrics. Developing simple and feasible strategy is meaningful and urgent for their acceptance to various applications. Herein, we utilize the high thermal conductivity and electrical insulation characteristic of Boron nitride and Aluminum nitride (BN/AIN) as the hybrid fillers for polyetherimide (PEl) matrix to increase dielectric constant and breakdown strength. This combination resulted in a high discharged energy density of 8.39 J/cm3 at 500 kV/mm with a high efficiency of 90.5% at a low filler fraction. This strategy provides a feasible option for a scalable manufacturing of high performance composite films in the future.

KW - Fabrication

KW - Insulation

KW - Dielectric constant

KW - Boron

KW - Electric breakdown

KW - Films

KW - Transfer functions

UR - https://ieeexplore.ieee.org/document/9568070/

U2 - 10.1109/ICEPT52650.2021.9568070

DO - 10.1109/ICEPT52650.2021.9568070

M3 - Conference contribution

SN - 978-1-6654-1392-3

SP - 1

EP - 3

BT - 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

PB - IEEE Canada

T2 - 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

Y2 - 14 September 2021 through 17 September 2021

ER -

Enhanced Discharged Energy Density in Polyetherimide Composites by Boron Nitride/Aluminum Nitride Hybrid Fillers

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Keywords

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