The correlation of microstructure and dielectric properties of different silica based thin films was studied. The Rutherford backscattering, x-ray reflectivity and ellipsometry measurements show that the spin-on deposition (SOD) films have a higher porosity than plasma enhanced chemical vapor deposition (PECVD) and chemical vapor deposition (CVD) films. The results show that the formation of air voids lowers the dielectric constant of the inhomogeneous two phase nanoporous silica based films deposited by SOD. It also show the existence of a homogeneous low density loose microstructure originating from a bonding nature in the PECVD/CVD films which leads to lowering of their dielectric constants to a small extent.
|Number of pages||6|
|Journal||Journal of Applied Physics|
|State||Published - 15 May 2004|