APPLICATIONS OF THIN ALLOY FILMS IN SILICIDE CONTACTS.

M. Eizenberg

APPLICATIONS OF THIN ALLOY FILMS IN SILICIDE CONTACTS.

^*Corresponding author for this work

Research output: Contribution to conference › Paper › peer-review

Abstract

The use of alloy films for silicon contacting can contribute to improvements in three aspects: 1) fabrication of shallow contacts, 2) formation of built-in diffusion barrier layers, and 3) controlling the electrical characteristics of the metal-Si interface. The nature of the reaction of the alloy film with the Si substrate (e. g. compound formation and component redistribution) and therefore the overall properties of the contact which determine its applicability, depend on the alloy composition and applied heat treatments. Studies of many systems enabled finding general trends and classifying various alloys in a few groups. A survey of our results which leads to conclusions about the potential applicability of alloy films for contacting is presented.

Original language	English
Pages	348-360
Number of pages	13
State	Published - 1984
Externally published	Yes

Cite this

@conference{5abf16cb5c7243c192ea6cb112ed9fd6,

title = "APPLICATIONS OF THIN ALLOY FILMS IN SILICIDE CONTACTS.",

abstract = "The use of alloy films for silicon contacting can contribute to improvements in three aspects: 1) fabrication of shallow contacts, 2) formation of built-in diffusion barrier layers, and 3) controlling the electrical characteristics of the metal-Si interface. The nature of the reaction of the alloy film with the Si substrate (e. g. compound formation and component redistribution) and therefore the overall properties of the contact which determine its applicability, depend on the alloy composition and applied heat treatments. Studies of many systems enabled finding general trends and classifying various alloys in a few groups. A survey of our results which leads to conclusions about the potential applicability of alloy films for contacting is presented.",

author = "M. Eizenberg",

year = "1984",

language = "英语",

pages = "348--360",

}

TY - CONF

T1 - APPLICATIONS OF THIN ALLOY FILMS IN SILICIDE CONTACTS.

AU - Eizenberg, M.

PY - 1984

Y1 - 1984

N2 - The use of alloy films for silicon contacting can contribute to improvements in three aspects: 1) fabrication of shallow contacts, 2) formation of built-in diffusion barrier layers, and 3) controlling the electrical characteristics of the metal-Si interface. The nature of the reaction of the alloy film with the Si substrate (e. g. compound formation and component redistribution) and therefore the overall properties of the contact which determine its applicability, depend on the alloy composition and applied heat treatments. Studies of many systems enabled finding general trends and classifying various alloys in a few groups. A survey of our results which leads to conclusions about the potential applicability of alloy films for contacting is presented.

AB - The use of alloy films for silicon contacting can contribute to improvements in three aspects: 1) fabrication of shallow contacts, 2) formation of built-in diffusion barrier layers, and 3) controlling the electrical characteristics of the metal-Si interface. The nature of the reaction of the alloy film with the Si substrate (e. g. compound formation and component redistribution) and therefore the overall properties of the contact which determine its applicability, depend on the alloy composition and applied heat treatments. Studies of many systems enabled finding general trends and classifying various alloys in a few groups. A survey of our results which leads to conclusions about the potential applicability of alloy films for contacting is presented.

UR - http://www.scopus.com/inward/record.url?scp=18344409975&partnerID=8YFLogxK

M3 - 论文

AN - SCOPUS:18344409975

SP - 348

EP - 360

ER -

APPLICATIONS OF THIN ALLOY FILMS IN SILICIDE CONTACTS.

Abstract

Other files and links

Fingerprint

Cite this