TiCN: A new chemical vapor deposited contact barrier metallization for submicron devices

M. Eizenberg*, K. Littau, S. Ghanayem, A. Mak, Y. Maeda, M. Chang, A. K. Sinha

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

69 Scopus citations

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Physics & Astronomy