The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum

Rimma Lapovok*, Alex Berner, Yuanshen Qi, Chunjee Xu, Eugen Rabkin, Yan Beygelzimer

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the “effective media” model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.

Original languageEnglish
Article number2000058
JournalAdvanced Engineering Materials
Volume22
Issue number6
DOIs
StatePublished - 1 Jun 2020

Keywords

  • conductivities
  • copper–aluminum hybrid materials
  • interfaces
  • intermetallics
  • powder compaction
  • reciprocal extrusions

Fingerprint

Dive into the research topics of 'The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum'. Together they form a unique fingerprint.

Cite this