Investigation of electromigration in copper interconnects by noise measurements

Vitali Emelianov*, Gopal Ganesan, Aleksandar Puzic, Stefan Schulz, Moshe Eizenberg, Hanns Ulrich Habermeier, Hermann Stoll

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations

Fingerprint Dive into the research topics of 'Investigation of electromigration in copper interconnects by noise measurements'. Together they form a unique fingerprint.

Mathematics

Physics & Astronomy

Chemical Compounds

Engineering & Materials Science