Facile patterning silicon wafer by Rochow reaction over patterned Cu-based catalysts

Wenfeng Ren, Yanhong Wang*, Zailei Zhang, Qiangqiang Tan, Ziyi Zhong, Fabing Su

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

Despite the promising application of patterned Si wafers (PSWs) in electrochemistry and photochemistry, the simple and environment-friendly fabrication of these PSWs is still a great challenge. Herein, we report a novel method for fabrication of PSWs via Rochow reaction, which is commonly used to produce organosilane monomers for synthesizing organosilane products in chemical industry. In this reaction, commercial Si wafers (SWs) reacted with gas CH 3 Cl over patterned various Cu-based catalyst to create regular patterns. PSWs were obtained after removal of Cu compounds followed with facile post treatment. Because of simplicity, low-cost and low-toxicity of this approach, the manufacture of PSWs on an industrial scale is highly possible, which can be realized by integrating the organosilane synthesis process and controlling the reaction conditions.

Original languageEnglish
Pages (from-to)192-197
Number of pages6
JournalApplied Surface Science
Volume360
DOIs
StatePublished - 1 Jan 2016
Externally publishedYes

Keywords

  • CH Cl
  • Copper catalysts
  • Direct-pattern
  • Rochow reaction
  • Si wafers

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