Dielectric property-microstructure relationship for nanoporous silica based thin films

I. Fisher*, W. D. Kaplan, M. Eizenberg

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

31 Scopus citations

Abstract

The correlation of microstructure and dielectric properties of different silica based thin films was studied. The Rutherford backscattering, x-ray reflectivity and ellipsometry measurements show that the spin-on deposition (SOD) films have a higher porosity than plasma enhanced chemical vapor deposition (PECVD) and chemical vapor deposition (CVD) films. The results show that the formation of air voids lowers the dielectric constant of the inhomogeneous two phase nanoporous silica based films deposited by SOD. It also show the existence of a homogeneous low density loose microstructure originating from a bonding nature in the PECVD/CVD films which leads to lowering of their dielectric constants to a small extent.

Original languageEnglish
Pages (from-to)5762-5767
Number of pages6
JournalJournal of Applied Physics
Volume95
Issue number10
DOIs
StatePublished - 15 May 2004
Externally publishedYes

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