Development of high temperature capacitors for high density, high temperature applications

Patricia C. Irwin*, Daniel Qi Tan, Yang Cao, Norberto Silvi, Mark Carter, Mark Rumler, Christophe Garet

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

A number of alternative capacitor technologies have been studied and high-temperature extruded polymer film capacitors hold the promise to meet the critical needs for temperature, energy density, reliability, cost and availability. Polymer resins capable of continuous use up to 200°C can be extruded into very thin films thereby permitting higher capacitor operating temperatures, higher energy density and improved cost structure compared to films manufactured by solvent casting processes. Studies of polymeric resins have shown that high-engineered polyetherimides show great promise for use as dielectric capacitor films. Polyetherimides can be melt extruded into thin films providing a low cost, environmentally friendly dielectric material. Discussions of the results of melt extrusion, metallization, and winding into electrostatic polyetherimide film capacitors will be given comparing and contrasting the results to other electrostatic film capacitor designs.

Original languageEnglish
JournalSAE Technical Papers
DOIs
StatePublished - 2008
Externally publishedYes
EventPower Systems Conference - Bellevue, WA, United States
Duration: 11 Nov 200813 Nov 2008

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