Development of high temperature capacitors for high density, high temperature applications

Patricia C. Irwin; Daniel Qi Tan; Yang Cao; Norberto Silvi; Mark Carter; Mark Rumler; Christophe Garet

doi:10.4271/2008-01-2851

Development of high temperature capacitors for high density, high temperature applications

Patricia C. Irwin, Daniel Qi Tan, Yang Cao, Norberto Silvi, Mark Carter, Mark Rumler, Christophe Garet

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

A number of alternative capacitor technologies have been studied and high-temperature extruded polymer film capacitors hold the promise to meet the critical needs for temperature, energy density, reliability, cost and availability. Polymer resins capable of continuous use up to 200 °C can be extruded into very thin films thereby permitting higher capacitor operating temperatures, higher energy density and improved cost structure compared to films manufactured by solvent casting processes. Studies of polymeric resins have shown that high-engineered polyetherimides show great promise for use as dielectric capacitor films. Polyetherimides can be melt extruded into thin films providing a low cost, environmentally friendly dielectric material. Discussions of the results of melt extrusion, metallization, and winding into electrostatic polyetherimide film capacitors will be given comparing and contrasting the results to other electrostatic film capacitor designs.

Original language	English
Pages (from-to)	817-821
Number of pages	5
Journal	SAE International Journal of Aerospace
Volume	1
Issue number	1
DOIs	https://doi.org/10.4271/2008-01-2851
State	Published - 2009
Externally published	Yes

Access to Document

10.4271/2008-01-2851

Cite this

@article{78b02a3eee944aa49365f88409def3d9,

title = "Development of high temperature capacitors for high density, high temperature applications",

abstract = "A number of alternative capacitor technologies have been studied and high-temperature extruded polymer film capacitors hold the promise to meet the critical needs for temperature, energy density, reliability, cost and availability. Polymer resins capable of continuous use up to 200 °C can be extruded into very thin films thereby permitting higher capacitor operating temperatures, higher energy density and improved cost structure compared to films manufactured by solvent casting processes. Studies of polymeric resins have shown that high-engineered polyetherimides show great promise for use as dielectric capacitor films. Polyetherimides can be melt extruded into thin films providing a low cost, environmentally friendly dielectric material. Discussions of the results of melt extrusion, metallization, and winding into electrostatic polyetherimide film capacitors will be given comparing and contrasting the results to other electrostatic film capacitor designs.",

author = "Irwin, {Patricia C.} and Tan, {Daniel Qi} and Yang Cao and Norberto Silvi and Mark Carter and Mark Rumler and Christophe Garet",

year = "2009",

doi = "10.4271/2008-01-2851",

language = "英语",

volume = "1",

pages = "817--821",

journal = "SAE International Journal of Aerospace",

issn = "1946-3855",

publisher = "SAE International",

number = "1",

}

TY - JOUR

T1 - Development of high temperature capacitors for high density, high temperature applications

AU - Irwin, Patricia C.

AU - Tan, Daniel Qi

AU - Cao, Yang

AU - Silvi, Norberto

AU - Carter, Mark

AU - Rumler, Mark

AU - Garet, Christophe

PY - 2009

Y1 - 2009

N2 - A number of alternative capacitor technologies have been studied and high-temperature extruded polymer film capacitors hold the promise to meet the critical needs for temperature, energy density, reliability, cost and availability. Polymer resins capable of continuous use up to 200 °C can be extruded into very thin films thereby permitting higher capacitor operating temperatures, higher energy density and improved cost structure compared to films manufactured by solvent casting processes. Studies of polymeric resins have shown that high-engineered polyetherimides show great promise for use as dielectric capacitor films. Polyetherimides can be melt extruded into thin films providing a low cost, environmentally friendly dielectric material. Discussions of the results of melt extrusion, metallization, and winding into electrostatic polyetherimide film capacitors will be given comparing and contrasting the results to other electrostatic film capacitor designs.

AB - A number of alternative capacitor technologies have been studied and high-temperature extruded polymer film capacitors hold the promise to meet the critical needs for temperature, energy density, reliability, cost and availability. Polymer resins capable of continuous use up to 200 °C can be extruded into very thin films thereby permitting higher capacitor operating temperatures, higher energy density and improved cost structure compared to films manufactured by solvent casting processes. Studies of polymeric resins have shown that high-engineered polyetherimides show great promise for use as dielectric capacitor films. Polyetherimides can be melt extruded into thin films providing a low cost, environmentally friendly dielectric material. Discussions of the results of melt extrusion, metallization, and winding into electrostatic polyetherimide film capacitors will be given comparing and contrasting the results to other electrostatic film capacitor designs.

UR - http://www.scopus.com/inward/record.url?scp=77953184018&partnerID=8YFLogxK

U2 - 10.4271/2008-01-2851

DO - 10.4271/2008-01-2851

M3 - 文章

AN - SCOPUS:77953184018

SN - 1946-3855

VL - 1

SP - 817

EP - 821

JO - SAE International Journal of Aerospace

JF - SAE International Journal of Aerospace

IS - 1

ER -

Development of high temperature capacitors for high density, high temperature applications

Abstract

Access to Document

Other files and links

Fingerprint

Cite this