Characterization of electroless deposited Co (W,P) thin films for encapsulation of copper metallization

A. Kohn*, M. Eizenberg, Y. Shacham-Diamand, Y. Sverdlov

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

111 Scopus citations

Fingerprint

Dive into the research topics of 'Characterization of electroless deposited Co (W,P) thin films for encapsulation of copper metallization'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds