Moshe Eizenberg

I. Krylov

Technion-Israel Institute of Technology
TOWER Semiconductor Ltd.

External person

31 shared research output

Dan Ritter

Technion-Israel Institute of Technology

External person

29 shared research output

R. Brener

Technion-Israel Institute of Technology

External person

25 shared research output

F. Palumbo

Universidad Tecnológica Nacional
Comisión Nacional de Energía Atómica
Consejo Nacional de Investigaciones Científicas y Técnicas
Technion-Israel Institute of Technology
CONICET/GAIANN-CAC-CNEA

External person

19 shared research output

Pini Shekhter

Technion-Israel Institute of Technology

External person

17 shared research output

R. Winter

Technion-Israel Institute of Technology

External person

17 shared research output

Lior Kornblum

Technion-Israel Institute of Technology

External person

16 shared research output

C. Cytermann

Technion-Israel Institute of Technology
Université Paris-Saclay

External person

15 shared research output

F. Meyer

Université Paris-Sud
Université Paris-Saclay
Technion-Israel Institute of Technology
CNRS

External person

13 shared research output

Arkady Gavrilov

Technion-Israel Institute of Technology

External person

12 shared research output

K. N. Tu

IBM

External person

11 shared research output

J. W. Mayer

Cornell University
Arizona State University

External person

10 shared research output

Y. Shacham-Diamand

Tel Aviv University
Cornell University

External person

10 shared research output

A. K. Sinha

Applied Materials Incorporated
Applied Conductor Technology Division
Texas Instruments

External person

10 shared research output

H. J. Osten

Leibniz University Hannover
Innovations for High Performance Microelectronics

External person

9 shared research output

A. Kohn

Technion-Israel Institute of Technology
University of Oxford

External person

9 shared research output

F. Edelman

Technion-Israel Institute of Technology
Jülich Research Centre

External person

9 shared research output

F. Schäffler

Daimler AG
Technion-Israel Institute of Technology
Technion

External person

9 shared research output

Sivan Fadida

Technion-Israel Institute of Technology

External person

9 shared research output

E. Lipp

Technion-Israel Institute of Technology

External person

9 shared research output

Kamira Weinfeld

Technion-Israel Institute of Technology

External person

8 shared research output

R. Weil

Technion-Israel Institute of Technology

External person

8 shared research output

W. Beyer

Jülich Research Centre

External person

8 shared research output

Paul C. McIntyre

Stanford University
Stanford University

External person

8 shared research output

Shlomo Mehari

Technion-Israel Institute of Technology

External person

8 shared research output

S. Pazos

Universidad Tecnológica Nacional
Comisión Nacional de Energía Atómica
Consejo Nacional de Investigaciones Científicas y Técnicas
CONICET/GAIANN-CAC-CNEA

External person

7 shared research output

J. A. Rothschild

Technion-Israel Institute of Technology

External person

7 shared research output

C. Schwebel

Université Paris-Sud
Université Paris-Saclay
CNRS

External person

7 shared research output

W. D. Kaplan

Technion-Israel Institute of Technology

External person

7 shared research output

R. Mosely

Applied Materials Incorporated
Technion-Israel Institute of Technology

External person

7 shared research output

A. Zeitouny

Technion-Israel Institute of Technology
University of Florida
University of Florida

External person

7 shared research output

I. Geppert

Technion-Israel Institute of Technology

External person

7 shared research output

S. J. Pearton

University of Florida
Office of Naval Research
University of Florida

External person

7 shared research output

S. P. Murarka

Lucent
Rensselaer Polytechnic Institute
Nokia

External person

7 shared research output

F. Aguirre

Universidad Tecnológica Nacional
Comisión Nacional de Energía Atómica
Consejo Nacional de Investigaciones Científicas y Técnicas
CONICET/GAIANN-CAC-CNEA
King Abdullah University of Science and Technology

External person

7 shared research output

F. Ren

University of Florida
University of Florida

External person

7 shared research output

M. Lyakas

Technion-Israel Institute of Technology

External person

6 shared research output

Karl A. Littau

Applied Materials Incorporated
Texas Instruments

External person

6 shared research output

Xianbin Xu

Technion-Israel Institute of Technology

External person

6 shared research output

Yaron Kauffmann

Technion-Israel Institute of Technology

External person

6 shared research output

Z. Atzmon

Technion-Israel Institute of Technology
Arizona State University

External person

6 shared research output

Ganpati Ramanath

Rensselaer Polytechnic Institute

External person

6 shared research output

A. Buxbaum

Technion-Israel Institute of Technology
The Solid State Institute
Technion

External person

6 shared research output

M. Heiblum

IBM

External person

5 shared research output

R. Fastow

Technion-Israel Institute of Technology
Cornell University

External person

5 shared research output

Valentina Korchnoy

Technion-Israel Institute of Technology

External person

5 shared research output

Yoram Shapira

Tel Aviv University

External person

5 shared research output

Ilanit Fisher

Lam Research Corporation
Technion-Israel Institute of Technology

External person

5 shared research output

E. Zolotoyabko

Technion-Israel Institute of Technology

External person

5 shared research output

R. J. Shul

Sandia National Laboratories
United States Army Research Laboratory

External person

5 shared research output

R. Kröger

Technion-Israel Institute of Technology

External person

5 shared research output

J. C. Zolper

Office of Naval Research
Technion-Israel Institute of Technology

External person

5 shared research output

Zuoguang Liu

Yale University

External person

5 shared research output

H. Strunk

Friedrich-Alexander University Erlangen-Nürnberg
Lehrst. Mikrocharakterisierung

External person

5 shared research output

A. Appelbaum

Lucent
Technion-Israel Institute of Technology
Nokia

External person

5 shared research output

T. P. Ma

Yale University

External person

5 shared research output

Hagay Marom

Technion-Israel Institute of Technology

External person

5 shared research output

A. Raizman

Soreq Nuclear Research Center
Technion-Israel Institute of Technology
Technion

External person

5 shared research output

Sharon Cui

Yale University

External person

5 shared research output

Yaron Amouyal

Technion-Israel Institute of Technology

External person

4 shared research output

Kechao Tang

Stanford University
Soochow University
Stanford University

External person

4 shared research output

X. A. Cao

University of Florida

External person

4 shared research output

C. R. Abernathy

University of Florida
University of Florida

External person

4 shared research output

Michal Danek

Lam Research Corporation
Applied Materials Incorporated

External person

4 shared research output

M. W. Cole

United States Army Research Laboratory
Sandia National Laboratories

External person

4 shared research output

M. Beregovsky

Technion-Israel Institute of Technology

External person

4 shared research output

L. Chen

Applied Materials Incorporated

External person

4 shared research output

D. D. Gandhi

Rensselaer Polytechnic Institute

External person

4 shared research output

N. Mosleh

Université Paris-Sud
Université Paris-Saclay
CNRS

External person

4 shared research output

M. Genut

Technion-Israel Institute of Technology

External person

4 shared research output

Eilam Yalon

Technion-Israel Institute of Technology
Stanford University
Stanford University

External person

4 shared research output

V. Demuth

Friedrich-Alexander University Erlangen-Nürnberg
Lehrst. Mikrocharakterisierung

External person

4 shared research output

Jaesoo Ahn

Stanford University
Stanford University

External person

4 shared research output

P. Gopal Ganesan

Technion-Israel Institute of Technology

External person

4 shared research output

N. Ariel

Technion-Israel Institute of Technology

External person

4 shared research output

Salvatore Lombardo

National Research Council of Italy

External person

4 shared research output

A. Golan

Tel Aviv University
Technion-Israel Institute of Technology

External person

4 shared research output

C. Pellet

Université Paris-Sud
CNRS
Université Paris-Saclay

External person

4 shared research output

D. Cong

Applied Materials Incorporated

External person

4 shared research output

A. Eyal

Université Paris-Saclay
Technion-Israel Institute of Technology
Université Paris-Sud
CNRS

External person

4 shared research output

D. Schwendt

Leibniz University Hannover
Trinos Vakuum-Systeme GmbH

External person

4 shared research output

V. Aubry-Fortuna

Université Paris-Sud
Université Paris-Saclay
CNRS

External person

3 shared research output

Shoshana Tamir

Technion-Israel Institute of Technology
Israel Inst of Metals

External person

3 shared research output

T. Guo

Technion-Israel Institute of Technology
Applied Materials Incorporated

External person

3 shared research output

A. P. Singh

Rensselaer Polytechnic Institute

External person

3 shared research output

S. Van Elshocht

Interuniversitair Micro-Elektronica Centrum

External person

3 shared research output

M. I. Nathan

IBM

External person

3 shared research output

J. R. Lothian

Multiplex Inc.
Lucent
Nokia

External person

3 shared research output

Boaz Pokroy

Technion-Israel Institute of Technology

External person

3 shared research output

L. Y. Chen

Applied Materials Incorporated

External person

3 shared research output

J. Salzman

Microelectronics Research Center
Technion-Israel Institute of Technology

External person

3 shared research output

C. Marcadal

Applied Materials Incorporated

External person

3 shared research output

M. Chang

Applied Materials Incorporated
Applied Conductor Technology Division

External person

3 shared research output

L. Nyns

Interuniversitair Micro-Elektronica Centrum

External person

3 shared research output

Xiao Sun

Yale University

External person

3 shared research output

M. Liao

Applied Materials Incorporated

External person

3 shared research output

U. König

Daimler AG

External person

3 shared research output

R. D. Thompson

IBM

External person

3 shared research output

Y. Y. Wu

Harbin Institute of Technology
Technion-Israel Institute of Technology

External person

3 shared research output

M. Glück

Daimler AG

External person

3 shared research output

A. Berner

Technion-Israel Institute of Technology

External person

3 shared research output

O. Chaix-Pluchery

Université Paris-Saclay
CNRS
Université Paris-Sud
Université Grenoble Alpes
ENSPG

External person

3 shared research output

Yigal Komem

Technion-Israel Institute of Technology
Technion

External person

3 shared research output

M. Barthula

Université Paris-Saclay
Université Paris-Sud
CNRS

External person

3 shared research output

N. Yoshida

Applied Materials Incorporated

External person

3 shared research output

Ekaterina Zoubenko

Technion-Israel Institute of Technology

External person

3 shared research output

B. Meyler

Technion-Israel Institute of Technology

External person

3 shared research output

J. Tseng

Applied Materials Incorporated

External person

2 shared research output

D. Carl

Applied Materials Incorporated

External person

2 shared research output

S. Cohen

Technion-Israel Institute of Technology

External person

2 shared research output

I. Grimberg

Technion-Israel Institute of Technology

External person

2 shared research output

A. Shriki

Technion-Israel Institute of Technology

External person

2 shared research output

Jürgen Schubert

JARA
Jülich Research Centre

External person

2 shared research output

B. Z. Weiss

Technion-Israel Institute of Technology

External person

2 shared research output

Yonatan Calahorra

Technion-Israel Institute of Technology
University of Cambridge

External person

2 shared research output

Wenqi Zhang

Nanjing University
Yale University

External person

2 shared research output

J. Zahavi

Israel Inst of Metals
Technion-Israel Institute of Technology

External person

2 shared research output

R. Beserman

Technion-Israel Institute of Technology

External person

2 shared research output

V. V. Afanas'Ev

KU Leuven

External person

2 shared research output

Ulrike Tisch

Technion-Israel Institute of Technology

External person

2 shared research output

A. Verdini

National Research Council of Italy
National Institute for Nuclear Physics

External person

2 shared research output

H. Zhang

Applied Materials Incorporated

External person

2 shared research output

Jie Yang

Yale University

External person

2 shared research output

Y. Wang

Applied Materials Incorporated

External person

2 shared research output

Cheng Yi Peng

National Taiwan University
Yale University

External person

2 shared research output

M. Lane

IBM

External person

2 shared research output

R. Kalish

Technion-Israel Institute of Technology

External person

2 shared research output

A. Stesmans

KU Leuven

External person

2 shared research output

D. Parnis

Technion-Israel Institute of Technology

External person

2 shared research output

E. Y. Tzou

Applied Materials Incorporated

External person

2 shared research output

J. M. Blakely

Cornell University

External person

2 shared research output

Oren Zonensain

Technion-Israel Institute of Technology

External person

2 shared research output

R. H. Havemann

Applied Materials Incorporated
Texas Instruments

External person

2 shared research output

Y. Miron

Technion-Israel Institute of Technology

External person

2 shared research output

C. J. Palmstrøm

Cornell University

External person

2 shared research output

Armin Segmüller

IBM

External person

2 shared research output

S. Guha

IBM

External person

2 shared research output

S. Iacopetti

Technion-Israel Institute of Technology

External person

2 shared research output

S. M. Donovan

University of Florida
University of Florida

External person

2 shared research output

A. R. Chaudhuri

Leibniz University Hannover

External person

2 shared research output

T. N. Jackson

Pennsylvania State University
IBM

External person

2 shared research output

H. Kibbel

Daimler AG

External person

2 shared research output

B. Fisher

Technion-Israel Institute of Technology

External person

2 shared research output

M. Copel

IBM

External person

2 shared research output

Stella Q. Hong

Cornell University

External person

2 shared research output

M. Czernohorsky

Leibniz University Hannover
Fraunhofer Institute for Photonic Microsystems

External person

2 shared research output

N. A. Bojarczuk

IBM
Technion-Israel Institute of Technology

External person

2 shared research output

K. Cohen Weinfeld

Technion-Israel Institute of Technology

External person

2 shared research output

D. A. Smith

IBM

External person

2 shared research output

S. Datta

Pennsylvania State University
Pennsylvania State University

External person

2 shared research output

J. Bregman

Tel Aviv University

External person

2 shared research output

Hossam Haick

Technion-Israel Institute of Technology

External person

2 shared research output

Matthew Kwan

Rensselaer Polytechnic Institute

External person

2 shared research output

A. Mak

Applied Materials Incorporated

External person

2 shared research output

A. Ali

Pennsylvania State University
Pennsylvania State University

External person

2 shared research output

Girish A. Dixit

Applied Materials Incorporated
Texas Instruments

External person

2 shared research output

S. Ramaswami

Applied Materials Incorporated

External person

2 shared research output

L. F. Edge

IBM

External person

2 shared research output

S. G. Telford

Applied Materials Incorporated
Applied Conductor Technology Division

External person

2 shared research output

L. Floreano

National Research Council of Italy
National Institute for Nuclear Physics

External person

2 shared research output

Harold J. Hovel

IBM

External person

2 shared research output

T. R. Gow

IBM

External person

2 shared research output

Alex Yoon

Applied Materials Incorporated

External person

2 shared research output

Y. Sverdlov

Tel Aviv University

External person

2 shared research output

Yair Paska

Technion-Israel Institute of Technology

External person

2 shared research output

P. Hubert Mutin

Institut Charles Gerhardt Montpellier
Université de Montpellier

External person

2 shared research output

M. Avinun

Technion-Israel Institute of Technology

External person

2 shared research output

T. Brat

Technion-Israel Institute of Technology

External person

2 shared research output

Juwen Gao

Lam Research Corporation

External person

2 shared research output

Y. Roichman

Technion-Israel Institute of Technology

External person

2 shared research output

M. Levit

Technion-Israel Institute of Technology

External person

2 shared research output

S. Yofis

Technion-Israel Institute of Technology

External person

2 shared research output

I. Shalish

Tel Aviv University
Harvard University

External person

2 shared research output

M. Naik

Technion-Israel Institute of Technology
Applied Materials Incorporated

External person

2 shared research output

S. Ghanayem

Applied Materials Incorporated

External person

2 shared research output

D. Saigal

Applied Materials Incorporated

External person

2 shared research output

H. Foell

IBM

External person

2 shared research output

V. Richter

Technion-Israel Institute of Technology

External person

1 shared research output

G. Gautherin

Université Paris-Sud
Université Paris-Saclay

External person

1 shared research output

Cheryl Knepfler

Applied Materials Incorporated

External person

1 shared research output

F. Cerbu

KU Leuven

External person

1 shared research output

I. Kymissis

Columbia University

External person

1 shared research output

Hermann Stoll

Max Planck Institute for Intelligent Systems

External person

1 shared research output

Y. Shnieder

Technion-Israel Institute of Technology

External person

1 shared research output

C. Dornfest

Applied Materials Incorporated

External person

1 shared research output

S. Yehezkel

Technion-Israel Institute of Technology

External person

1 shared research output

Y. Dafne

Intel

External person

1 shared research output

L. M. Ting

Texas Instruments

External person

1 shared research output

O. Yam

Technion-Israel Institute of Technology

External person

1 shared research output

Michael Yang

Applied Materials Incorporated

External person

1 shared research output

G. Segal

Tel Aviv University

External person

1 shared research output

M. Houssa

KU Leuven

External person

1 shared research output

Timothy Weidman

Applied Materials Incorporated

External person

1 shared research output

J. Greenblatt

Tadiran Ltd.

External person

1 shared research output

L. Y. Chen

Applied Materials Incorporated

External person

1 shared research output

M. Caymax

Interuniversitair Micro-Elektronica Centrum

External person

1 shared research output

N. Barel

Technion-Israel Institute of Technology

External person

1 shared research output

G. Ankonina

Technion-Israel Institute of Technology

External person

1 shared research output

J. Mullin

TOWER Semiconductor Ltd.

External person

1 shared research output

M. Avinum

Technion-Israel Institute of Technology

External person

1 shared research output

P. A. Psaras

IBM

External person

1 shared research output

Gopal Ganesan

Technion-Israel Institute of Technology
Department of Materials Engineering

External person

1 shared research output

Hua Chung

Applied Materials Incorporated

External person

1 shared research output

C. E.M. De Oliveira

Tel Aviv University

External person

1 shared research output

K. S. Chang-Liao

National Tsing Hua University

External person

1 shared research output

T. F. Wietler

Leibniz University Hannover

External person

1 shared research output

A. C. Callegari

IBM

External person

1 shared research output

N. Braslau

IBM

External person

1 shared research output

J. Roberts

Applied Materials Incorporated

External person

1 shared research output

Patrick Van Cleemput

Lam Research Corporation

External person

1 shared research output

R. Misra

Pennsylvania State University

External person

1 shared research output

Qi Zhong Hong

Texas Instruments

External person

1 shared research output

W. Heinrich

Daimler AG

External person

1 shared research output

N. M. Kolomiiets

KU Leuven

External person

1 shared research output

V. V.S. Rana

Applied Materials Incorporated

External person

1 shared research output

E. Hwang

Pennsylvania State University

External person

1 shared research output

Ajit Paranjpe

Texas Instruments

External person

1 shared research output

B. Singh

Rensselaer Polytechnic Institute

External person

1 shared research output

R. Zaharia

Technion-Israel Institute of Technology

External person

1 shared research output

E. Sader

Intel

External person

1 shared research output

J. Hersener

Daimler AG

External person

1 shared research output

L. Kronik

Tel Aviv University

External person

1 shared research output

Chao Wen

Soochow University

External person

1 shared research output

J. D. Luttmer

Texas Instruments

External person

1 shared research output

Iain Thayne

University of Glasgow

External person

1 shared research output

H. Avraham

Technion-Israel Institute of Technology

External person

1 shared research output

Z. Shahar

Technion-Israel Institute of Technology

External person

1 shared research output

Manoj K. Jain

Applied Materials Incorporated

External person

1 shared research output

Ryan Brock

Stanford University
Stanford University

External person

1 shared research output

M. Zafrany

Technion-Israel Institute of Technology

External person

1 shared research output

P. M. Mooney

IBM

External person

1 shared research output

A. Fenigstein

TOWER Semiconductor Ltd.

External person

1 shared research output

J. Han

Sandia National Laboratories

External person

1 shared research output

Y. E. Gilboa

Technion-Israel Institute of Technology

External person

1 shared research output

Moris Kori

Applied Materials Incorporated

External person

1 shared research output

Y. Roizin

TOWER Semiconductor Ltd.

External person

1 shared research output

J. B. Boos

Naval Research Laboratory

External person

1 shared research output

S. Ghanavem

Applied Materials Incorporated

External person

1 shared research output

Greg Harm

Lam Research Corporation

External person

1 shared research output

S. Hung

Applied Materials Incorporated

External person

1 shared research output

P. A. Heimann

Lucent
Nokia

External person

1 shared research output

Shammai Speiser

Technion-Israel Institute of Technology

External person

1 shared research output

P. Revesz

Cornell University

External person

1 shared research output

Z. Shpilman

Technion-Israel Institute of Technology

External person

1 shared research output

E. Ratner

Technion-Israel Institute of Technology

External person

1 shared research output

Michael Nault

Applied Materials Incorporated

External person

1 shared research output

U. Hörmann

Friedrich-Alexander University Erlangen-Nürnberg

External person

1 shared research output

E. Lyakin

Technion-Israel Institute of Technology

External person

1 shared research output

E. Rabkin

Technion-Israel Institute of Technology

External person

1 shared research output

A. Agrawal

Pennsylvania State University

External person

1 shared research output

Amy Zhang

Applied Materials Incorporated

External person

1 shared research output

Robert Jackson

Applied Materials Incorporated

External person

1 shared research output

Aleksandar Puzic

Max Planck Institute for Intelligent Systems
University of Stuttgart

External person

1 shared research output

Hanns Ulrich Habermeier

Max Planck Institute for Solid State Research
Kunming University of Science and Technology
Inst. Adv. Mat. for Photoelectron.

External person

1 shared research output

H. Tran

Applied Materials Incorporated

External person

1 shared research output

A. Laha

Indian Institute of Technology Bombay

External person

1 shared research output

P. M. Lenahan

Pennsylvania State University

External person

1 shared research output

M. Ben-Tzur

Technion-Israel Institute of Technology

External person

1 shared research output

Stefan Schulz

Chemnitz University of Technology

External person

1 shared research output

H. Madan

Pennsylvania State University

External person

1 shared research output

Al Morrison

Texas Instruments

External person

1 shared research output

Yu Zhou

Rensselaer Polytechnic Institute

External person

1 shared research output

S. E. Mohney

Pennsylvania State University

External person

1 shared research output

Hongbin Fang

Applied Materials Incorporated

External person

1 shared research output

G. Tremblay

Université Paris-Sud
Université Paris-Saclay

External person

1 shared research output

D. V. Andreev

Bauman Moscow State Technical University
KU Leuven

External person

1 shared research output

L. Burstein

Tel Aviv University

External person

1 shared research output

Ravi Droopad

Texas State University

External person

1 shared research output

S. Boyeras Baldomá

Universidad Tecnológica Nacional
Consejo Nacional de Investigaciones Científicas y Técnicas

External person

1 shared research output

Aya Cohen

Technion-Israel Institute of Technology

External person

1 shared research output

B. R. Bennett

Naval Research Laboratory

External person

1 shared research output

Tom Mountsier

Lam Research Corporation

External person

1 shared research output

Drew Paul

Texas Instruments

External person

1 shared research output

D. K. Sadana

IBM

External person

1 shared research output

M. Rösler

Daimler AG

External person

1 shared research output

A. Schüppen

Daimler AG

External person

1 shared research output

Cecile Uzan-Saguy

Technion-Israel Institute of Technology

External person

1 shared research output

David J. Smith

Arizona State University

External person

1 shared research output

G. Ottaviani

IBM

External person

1 shared research output

W. Dorsch

Lehrst. Mikrocharakterisierung

External person

1 shared research output

B. C. Bittel

Pennsylvania State University

External person

1 shared research output

B. Israel

Tel Aviv University

External person

1 shared research output

M. Lisiansky

TOWER Semiconductor Ltd.

External person

1 shared research output

J. Owyang

Aviza Technology Inc.

External person

1 shared research output

L. Chen

External person

1 shared research output

A. Fissel

Leibniz University Hannover

External person

1 shared research output

S. Zhou

Applied Materials Incorporated

External person

1 shared research output

Ming Feng Chang

National Yang Ming Chiao Tung University

External person

1 shared research output

L. Breuil

Interuniversitair Micro-Elektronica Centrum

External person

1 shared research output

Marika Gunji

Stanford University
Stanford University

External person

1 shared research output

H. Bakhru

SUNY

External person

1 shared research output

J. Strand

University College London

External person

1 shared research output

O. Madia

KU Leuven

External person

1 shared research output

V. Aubry-Fortuna

Université Paris-Sud
CNRS

External person

1 shared research output

M. Efrati Fastow

Technion-Israel Institute of Technology

External person

1 shared research output

A. Gladkikh

Tel Aviv University

External person

1 shared research output

Saroj Nayak

Rensselaer Polytechnic Institute

External person

1 shared research output

David Mistele

Technion-Israel Institute of Technology

External person

1 shared research output

L. Bartholomew

Aviza Technology Inc.

External person

1 shared research output

Y. Maeda

Applied Materials Incorporated

External person

1 shared research output

Martin Holland

University of Glasgow

External person

1 shared research output

E. Holzman

Technion-Israel Institute of Technology

External person

1 shared research output

I. Levin

Technion-Israel Institute of Technology

External person

1 shared research output

Y. Raskin

TOWER Semiconductor Ltd.

External person

1 shared research output

I. Moskowitz

Technion-Israel Institute of Technology

External person

1 shared research output

Reinhold H. Dauskardt

Stanford University
Stanford University

External person

1 shared research output

Michael F. Chisholm

Applied Materials Incorporated

External person

1 shared research output

F. Fortuna

Université Paris-Sud
Université Paris-Saclay

External person

1 shared research output

Jeong Soo Byun

Applied Materials Incorporated

External person

1 shared research output

Y. Le Meur

Université Paris-Sud
IBM
CNRS

External person

1 shared research output

D. Bouchier

Université Paris-Sud
Université Paris-Saclay

External person

1 shared research output

J. G. Lisoni

Interuniversitair Micro-Elektronica Centrum
Universidad Austral de Chile

External person

1 shared research output

Yair Slovatizky

Technion-Israel Institute of Technology

External person

1 shared research output

Robert Tang-Kong

Stanford University
Stanford University

External person

1 shared research output

Liangliang Zhang

Stanford University
Stanford University

External person

1 shared research output

P. Schiffer

Pennsylvania State University

External person

1 shared research output

D. Cvetko

University of Ljubljana
National Research Council of Italy

External person

1 shared research output

T. Arazi

Technion-Israel Institute of Technology

External person

1 shared research output

E. Koltin

Technion-Israel Institute of Technology

External person

1 shared research output

Yu L. Khait

Technion-Israel Institute of Technology

External person

1 shared research output

M. Peisach

Weizmann Institute of Science

External person

1 shared research output

M. Ritterband

Technion-Israel Institute of Technology

External person

1 shared research output

J. A. Kittl

Samsung
KU Leuven

External person

1 shared research output

S. Joseph

Technion-Israel Institute of Technology

External person

1 shared research output

T. C.U. Tromm

Jülich Research Centre

External person

1 shared research output

Santiago Boyeras

Universidad Tecnológica Nacional

External person

1 shared research output

C. R. Abemathy

United States Army Research Laboratory

External person

1 shared research output

A. Benhocine

Université Paris-Sud
Université Paris-Saclay

External person

1 shared research output

Kaushik Chattopadhyay

Lam Research Corporation

External person

1 shared research output

Ming Xi

Applied Materials Incorporated

External person

1 shared research output

Gad Bahir

Technion-Israel Institute of Technology

External person

1 shared research output

A. Heiman

TOWER Semiconductor Ltd.

External person

1 shared research output

P. Möller

Université Paris-Sud
CNRS

External person

1 shared research output

Jonathan Avner Rothschild

Technion-Israel Institute of Technology

External person

1 shared research output

Anna Brusilovsky

Technion-Israel Institute of Technology

External person

1 shared research output

J. O. Olowolafe

Obafemi Awolowo University

External person

1 shared research output

A. G. Baca

Sandia National Laboratories

External person

1 shared research output

L. Y. Chen

External person

1 shared research output

D. Shilo

Technion-Israel Institute of Technology
Technion

External person

1 shared research output

M. Fastow

Technion-Israel Institute of Technology

External person

1 shared research output

I. Ramirez

Pennsylvania State University

External person

1 shared research output

Vitali Emelianov

Max Planck Institute for Intelligent Systems

External person

1 shared research output

A. L. Shluger

University College London
Tohoku University

External person

1 shared research output

Jared Tracy

Stanford University
Stanford University

External person

1 shared research output

P. Warren

Swiss Federal Institute of Technology Lausanne

External person

1 shared research output

Moshe Eizenberg

Network