TY - JOUR
T1 - Unified Modeling Suite for Two-Phase Flow, Convective Boiling, and Condensation in Macro-and Microchannels
AU - Thome, John R.
AU - Cioncolini, Andrea
N1 - Publisher Copyright:
© 2016 Taylor and Francis Group, LLC.
PY - 2016/9/21
Y1 - 2016/9/21
N2 - This paper focuses on the unified modeling suite for annular flow that the authors have developed and continue to develop. The annular flow suite currently includes models to predict the void fraction, the entrained liquid fraction, and the wall shear stress and pressure gradient, and a turbulence model for momentum and heat transport inside the annular liquid film. The turbulence model, in particular, allows prediction of the local average liquid film thicknesses and the local heat transfer coefficients during convective evaporation and condensation. The benefit of a unified modeling suite is that all the included prediction methods are consistently formulated and are proven to work well together, and provide a platform for continued advancement based on the other models in the suite. First the unified suite of methods is presented, illustrating in particular the most recent updates. Then results for the pressure drop and the heat transfer coefficient during convective evaporation and condensation are presented and discussed, covering both water and refrigerants flowing through circular tubes and noncircular multi-microchannel configurations for microelectronics cooling.
AB - This paper focuses on the unified modeling suite for annular flow that the authors have developed and continue to develop. The annular flow suite currently includes models to predict the void fraction, the entrained liquid fraction, and the wall shear stress and pressure gradient, and a turbulence model for momentum and heat transport inside the annular liquid film. The turbulence model, in particular, allows prediction of the local average liquid film thicknesses and the local heat transfer coefficients during convective evaporation and condensation. The benefit of a unified modeling suite is that all the included prediction methods are consistently formulated and are proven to work well together, and provide a platform for continued advancement based on the other models in the suite. First the unified suite of methods is presented, illustrating in particular the most recent updates. Then results for the pressure drop and the heat transfer coefficient during convective evaporation and condensation are presented and discussed, covering both water and refrigerants flowing through circular tubes and noncircular multi-microchannel configurations for microelectronics cooling.
UR - http://www.scopus.com/inward/record.url?scp=84959044195&partnerID=8YFLogxK
U2 - 10.1080/01457632.2015.1112212
DO - 10.1080/01457632.2015.1112212
M3 - 文章
AN - SCOPUS:84959044195
SN - 0145-7632
VL - 37
SP - 1148
EP - 1157
JO - Heat Transfer Engineering
JF - Heat Transfer Engineering
IS - 13-14
ER -