The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum

Rimma Lapovok; Alex Berner; Yuanshen Qi; Chunjee Xu; Eugen Rabkin; Yan Beygelzimer

doi:10.1002/adem.202000058

The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum

Rimma Lapovok^*, Alex Berner, Yuanshen Qi, Chunjee Xu, Eugen Rabkin, Yan Beygelzimer

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the “effective media” model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.

Original language	English
Article number	2000058
Journal	Advanced Engineering Materials
Volume	22
Issue number	6
DOIs	https://doi.org/10.1002/adem.202000058
State	Published - 1 Jun 2020
Externally published	Yes

Keywords

conductivities
copper–aluminum hybrid materials
interfaces
intermetallics
powder compaction
reciprocal extrusions

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10.1002/adem.202000058

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@article{ecfd563ffef64d38be17692d77852797,

title = "The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum",

abstract = "Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the “effective media” model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.",

keywords = "conductivities, copper–aluminum hybrid materials, interfaces, intermetallics, powder compaction, reciprocal extrusions",

author = "Rimma Lapovok and Alex Berner and Yuanshen Qi and Chunjee Xu and Eugen Rabkin and Yan Beygelzimer",

note = "Publisher Copyright: {\textcopyright} 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim",

year = "2020",

month = jun,

day = "1",

doi = "10.1002/adem.202000058",

language = "英语",

volume = "22",

journal = "Advanced Engineering Materials",

issn = "1438-1656",

publisher = "Wiley-VCH Verlag",

number = "6",

}

TY - JOUR

T1 - The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum

AU - Lapovok, Rimma

AU - Berner, Alex

AU - Qi, Yuanshen

AU - Xu, Chunjee

AU - Rabkin, Eugen

AU - Beygelzimer, Yan

PY - 2020/6/1

Y1 - 2020/6/1

N2 - Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the “effective media” model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.

AB - Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the “effective media” model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.

KW - conductivities

KW - copper–aluminum hybrid materials

KW - interfaces

KW - intermetallics

KW - powder compaction

KW - reciprocal extrusions

UR - http://www.scopus.com/inward/record.url?scp=85081727388&partnerID=8YFLogxK

U2 - 10.1002/adem.202000058

DO - 10.1002/adem.202000058

M3 - 文章

AN - SCOPUS:85081727388

SN - 1438-1656

VL - 22

JO - Advanced Engineering Materials

JF - Advanced Engineering Materials

IS - 6

M1 - 2000058

ER -

The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum

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Keywords

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