Stabilization of ultrafine-grained microstructure in high-purity copper by gas-filled pores produced by severe plastic deformation

Yuanshen Qi; Anna Kosinova; Askar R. Kilmametov; Boris B. Straumal; Eugen Rabkin

doi:10.1016/j.scriptamat.2019.10.050

Stabilization of ultrafine-grained microstructure in high-purity copper by gas-filled pores produced by severe plastic deformation

Yuanshen Qi^*, Anna Kosinova, Askar R. Kilmametov, Boris B. Straumal, Eugen Rabkin

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

We observed very high thermal stability (after annealing at 600 °C for 1 h) of the near-surface layers of ultrafine grains in the 99.9995 wt% (5N5) purity Cu processed by high-pressure torsion. We attributed this extraordinary thermal stability of ultrafine-grained microstructure to the nitrogen-filled nano-sized pores that pinned the grain boundaries. Our study reveals that a combination of severe shear strain and surface attrition causes the capture of N₂ molecules in the near-surface layer of the deformed metal from the ambient atmosphere. This phenomenon may play an important role in formation of percolating porosity in metals processed by severe plastic deformation.

Original language	English
Pages (from-to)	29-33
Number of pages	5
Journal	Scripta Materialia
Volume	178
DOIs	https://doi.org/10.1016/j.scriptamat.2019.10.050
State	Published - 15 Mar 2020
Externally published	Yes

Keywords

Copper
Electron energy loss spectroscopy (EELS)
Grain boundary migration
High-pressure torsion
Thermal stability

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10.1016/j.scriptamat.2019.10.050

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@article{625bfe23bbf8444e985e4ec4c912e781,

title = "Stabilization of ultrafine-grained microstructure in high-purity copper by gas-filled pores produced by severe plastic deformation",

abstract = "We observed very high thermal stability (after annealing at 600 °C for 1 h) of the near-surface layers of ultrafine grains in the 99.9995 wt% (5N5) purity Cu processed by high-pressure torsion. We attributed this extraordinary thermal stability of ultrafine-grained microstructure to the nitrogen-filled nano-sized pores that pinned the grain boundaries. Our study reveals that a combination of severe shear strain and surface attrition causes the capture of N2 molecules in the near-surface layer of the deformed metal from the ambient atmosphere. This phenomenon may play an important role in formation of percolating porosity in metals processed by severe plastic deformation.",

keywords = "Copper, Electron energy loss spectroscopy (EELS), Grain boundary migration, High-pressure torsion, Thermal stability",

author = "Yuanshen Qi and Anna Kosinova and Kilmametov, {Askar R.} and Straumal, {Boris B.} and Eugen Rabkin",

note = "Publisher Copyright: {\textcopyright} 2019 Acta Materialia Inc.",

year = "2020",

month = mar,

day = "15",

doi = "10.1016/j.scriptamat.2019.10.050",

language = "英语",

volume = "178",

pages = "29--33",

journal = "Scripta Materialia",

issn = "1359-6462",

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}

TY - JOUR

T1 - Stabilization of ultrafine-grained microstructure in high-purity copper by gas-filled pores produced by severe plastic deformation

AU - Qi, Yuanshen

AU - Kosinova, Anna

AU - Kilmametov, Askar R.

AU - Straumal, Boris B.

AU - Rabkin, Eugen

PY - 2020/3/15

Y1 - 2020/3/15

N2 - We observed very high thermal stability (after annealing at 600 °C for 1 h) of the near-surface layers of ultrafine grains in the 99.9995 wt% (5N5) purity Cu processed by high-pressure torsion. We attributed this extraordinary thermal stability of ultrafine-grained microstructure to the nitrogen-filled nano-sized pores that pinned the grain boundaries. Our study reveals that a combination of severe shear strain and surface attrition causes the capture of N2 molecules in the near-surface layer of the deformed metal from the ambient atmosphere. This phenomenon may play an important role in formation of percolating porosity in metals processed by severe plastic deformation.

AB - We observed very high thermal stability (after annealing at 600 °C for 1 h) of the near-surface layers of ultrafine grains in the 99.9995 wt% (5N5) purity Cu processed by high-pressure torsion. We attributed this extraordinary thermal stability of ultrafine-grained microstructure to the nitrogen-filled nano-sized pores that pinned the grain boundaries. Our study reveals that a combination of severe shear strain and surface attrition causes the capture of N2 molecules in the near-surface layer of the deformed metal from the ambient atmosphere. This phenomenon may play an important role in formation of percolating porosity in metals processed by severe plastic deformation.

KW - Copper

KW - Electron energy loss spectroscopy (EELS)

KW - Grain boundary migration

KW - High-pressure torsion

KW - Thermal stability

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U2 - 10.1016/j.scriptamat.2019.10.050

DO - 10.1016/j.scriptamat.2019.10.050

M3 - 文章

AN - SCOPUS:85074635172

SN - 1359-6462

VL - 178

SP - 29

EP - 33

JO - Scripta Materialia

JF - Scripta Materialia

ER -

Stabilization of ultrafine-grained microstructure in high-purity copper by gas-filled pores produced by severe plastic deformation

Abstract

Keywords

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