Abstract
Film capacitor technology has been under development for over half a century to meet various applications such as direct-current link capacitors for transportation, converters/inverters for power electronics, controls for deep well drilling of oil and gas, direct energy weapons for military use, and high-frequency coupling circuitry. The biaxially oriented polypropylene film capacitor remains the state-of-the-art technology; however, it is not able to meet increasing demand for high-temperature (>125°C) applications. A number of dielectric materials capable of operating at high temperatures (>140°C) have attracted investigation, and their modifications are being pursued to achieve higher volumetric efficiency as well. This paper highlights the status of polymer dielectric film development and its feasibility for capacitor applications. High-temperature polymers such as polyetherimide (PEI), polyimide, and polyetheretherketone were the focus of our studies. PEI film was found to be the preferred choice for high-temperature film capacitor development due to its thermal stability, dielectric properties, and scalability.
| Original language | English |
|---|---|
| Pages (from-to) | 4569-4575 |
| Number of pages | 7 |
| Journal | Journal of Electronic Materials |
| Volume | 43 |
| Issue number | 12 |
| DOIs | |
| State | Published - Dec 2014 |
| Externally published | Yes |
Keywords
- Polyetherimide
- breakdown strength
- dielectric constant
- dielectric loss
- energy density
- high-temperature capacitors
- modification of polymer
- polymer film