High-resolution, high-aspect ratio conductive wires embedded in plastic substrates

Ankit Mahajan; Woo Jin Hyun; S. Brett Walker; Jennifer A. Lewis; Lorraine F. Francis; C. Daniel Frisbie

doi:10.1021/am507539a

High-resolution, high-aspect ratio conductive wires embedded in plastic substrates

Ankit Mahajan, Woo Jin Hyun, S. Brett Walker, Jennifer A. Lewis, Lorraine F. Francis^*, C. Daniel Frisbie

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

40 Scopus citations

Abstract

A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the channels by capillary forces. These features serve as a seed layer for copper deposition inside the channels via electroless plating. Highly conductive wires (>50% bulk metal) with minimum line width and spacing of 2 and 4 μm, respectively, and an aspect ratio of 0.6 are obtained. The embedded wires exhibit good mechanical flexibility, with minimal degradation in electrical performance after thousands of bending cycles.

Original language	English
Pages (from-to)	1841-1847
Number of pages	7
Journal	ACS applied materials & interfaces
Volume	7
Issue number	3
DOIs	https://doi.org/10.1021/am507539a
State	Published - 28 Jan 2015
Externally published	Yes

Keywords

copper electroless plating
flexible electronics
high-resolution metal lines
imprint lithography
inkjet printing

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10.1021/am507539a

Cite this

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title = "High-resolution, high-aspect ratio conductive wires embedded in plastic substrates",

abstract = "A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the channels by capillary forces. These features serve as a seed layer for copper deposition inside the channels via electroless plating. Highly conductive wires (>50% bulk metal) with minimum line width and spacing of 2 and 4 μm, respectively, and an aspect ratio of 0.6 are obtained. The embedded wires exhibit good mechanical flexibility, with minimal degradation in electrical performance after thousands of bending cycles.",

keywords = "copper electroless plating, flexible electronics, high-resolution metal lines, imprint lithography, inkjet printing",

author = "Ankit Mahajan and Hyun, {Woo Jin} and Walker, {S. Brett} and Lewis, {Jennifer A.} and Francis, {Lorraine F.} and Frisbie, {C. Daniel}",

note = "Publisher Copyright: {\textcopyright} 2015 American Chemical Society.",

year = "2015",

month = jan,

day = "28",

doi = "10.1021/am507539a",

language = "英语",

volume = "7",

pages = "1841--1847",

journal = "ACS applied materials & interfaces",

issn = "1944-8244",

publisher = "American Chemical Society",

number = "3",

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T1 - High-resolution, high-aspect ratio conductive wires embedded in plastic substrates

AU - Mahajan, Ankit

AU - Hyun, Woo Jin

AU - Walker, S. Brett

AU - Lewis, Jennifer A.

AU - Francis, Lorraine F.

AU - Frisbie, C. Daniel

PY - 2015/1/28

Y1 - 2015/1/28

N2 - A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the channels by capillary forces. These features serve as a seed layer for copper deposition inside the channels via electroless plating. Highly conductive wires (>50% bulk metal) with minimum line width and spacing of 2 and 4 μm, respectively, and an aspect ratio of 0.6 are obtained. The embedded wires exhibit good mechanical flexibility, with minimal degradation in electrical performance after thousands of bending cycles.

AB - A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the channels by capillary forces. These features serve as a seed layer for copper deposition inside the channels via electroless plating. Highly conductive wires (>50% bulk metal) with minimum line width and spacing of 2 and 4 μm, respectively, and an aspect ratio of 0.6 are obtained. The embedded wires exhibit good mechanical flexibility, with minimal degradation in electrical performance after thousands of bending cycles.

KW - copper electroless plating

KW - flexible electronics

KW - high-resolution metal lines

KW - imprint lithography

KW - inkjet printing

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DO - 10.1021/am507539a

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High-resolution, high-aspect ratio conductive wires embedded in plastic substrates

Abstract

Keywords

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