Defect Removal by Solvent Vapor Annealing in Thin Films of Lamellar Diblock Copolymers

Xinpeng Xu; Xingkun Man; Masao Doi; Zhong Can Ou-Yang; David Andelman

doi:10.1021/acs.macromol.9b01181

Defect Removal by Solvent Vapor Annealing in Thin Films of Lamellar Diblock Copolymers

Xinpeng Xu^*, Xingkun Man, Masao Doi, Zhong Can Ou-Yang, David Andelman

^*Corresponding author for this work

Physics

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

Solvent vapor annealing (SVA) is known to be a simple, low-cost, and highly efficient technique to produce defect-free diblock copolymer (BCP) thin films. Not only can the solvent weaken the BCP segmental interactions but it can also vary the characteristic spacing of the BCP microstructures. We carry out systematic theoretical studies on the effect of adding a solvent into lamellar BCP thin films on the defect removal close to the BCP order-disorder transition. We find that the increase of the lamellar spacing, as is induced by addition of the solvent, facilitates more efficient removal of defects. The stability of a particular defect in a lamellar BCP thin film is given in terms of two key controllable parameters: the amount of BCP swelling and the solvent-evaporation rate. Our results highlight the SVA mechanism for obtaining defect-free BCP thin films, as is highly desired in nanolithography and other industrial applications.

Original language	English
Pages (from-to)	9321-9333
Number of pages	13
Journal	Macromolecules
Volume	52
Issue number	23
DOIs	https://doi.org/10.1021/acs.macromol.9b01181
State	Published - 10 Dec 2019

Access to Document

10.1021/acs.macromol.9b01181

Cite this

@article{5c8318acda2e461fac78599a01202e1f,

title = "Defect Removal by Solvent Vapor Annealing in Thin Films of Lamellar Diblock Copolymers",

abstract = "Solvent vapor annealing (SVA) is known to be a simple, low-cost, and highly efficient technique to produce defect-free diblock copolymer (BCP) thin films. Not only can the solvent weaken the BCP segmental interactions but it can also vary the characteristic spacing of the BCP microstructures. We carry out systematic theoretical studies on the effect of adding a solvent into lamellar BCP thin films on the defect removal close to the BCP order-disorder transition. We find that the increase of the lamellar spacing, as is induced by addition of the solvent, facilitates more efficient removal of defects. The stability of a particular defect in a lamellar BCP thin film is given in terms of two key controllable parameters: the amount of BCP swelling and the solvent-evaporation rate. Our results highlight the SVA mechanism for obtaining defect-free BCP thin films, as is highly desired in nanolithography and other industrial applications.",

author = "Xinpeng Xu and Xingkun Man and Masao Doi and Ou-Yang, {Zhong Can} and David Andelman",

note = "Publisher Copyright: Copyright {\textcopyright} 2019 American Chemical Society.",

year = "2019",

month = dec,

day = "10",

doi = "10.1021/acs.macromol.9b01181",

language = "英语",

volume = "52",

pages = "9321--9333",

journal = "Macromolecules",

issn = "0024-9297",

publisher = "American Chemical Society",

number = "23",

}

TY - JOUR

T1 - Defect Removal by Solvent Vapor Annealing in Thin Films of Lamellar Diblock Copolymers

AU - Xu, Xinpeng

AU - Man, Xingkun

AU - Doi, Masao

AU - Ou-Yang, Zhong Can

AU - Andelman, David

PY - 2019/12/10

Y1 - 2019/12/10

N2 - Solvent vapor annealing (SVA) is known to be a simple, low-cost, and highly efficient technique to produce defect-free diblock copolymer (BCP) thin films. Not only can the solvent weaken the BCP segmental interactions but it can also vary the characteristic spacing of the BCP microstructures. We carry out systematic theoretical studies on the effect of adding a solvent into lamellar BCP thin films on the defect removal close to the BCP order-disorder transition. We find that the increase of the lamellar spacing, as is induced by addition of the solvent, facilitates more efficient removal of defects. The stability of a particular defect in a lamellar BCP thin film is given in terms of two key controllable parameters: the amount of BCP swelling and the solvent-evaporation rate. Our results highlight the SVA mechanism for obtaining defect-free BCP thin films, as is highly desired in nanolithography and other industrial applications.

AB - Solvent vapor annealing (SVA) is known to be a simple, low-cost, and highly efficient technique to produce defect-free diblock copolymer (BCP) thin films. Not only can the solvent weaken the BCP segmental interactions but it can also vary the characteristic spacing of the BCP microstructures. We carry out systematic theoretical studies on the effect of adding a solvent into lamellar BCP thin films on the defect removal close to the BCP order-disorder transition. We find that the increase of the lamellar spacing, as is induced by addition of the solvent, facilitates more efficient removal of defects. The stability of a particular defect in a lamellar BCP thin film is given in terms of two key controllable parameters: the amount of BCP swelling and the solvent-evaporation rate. Our results highlight the SVA mechanism for obtaining defect-free BCP thin films, as is highly desired in nanolithography and other industrial applications.

UR - http://www.scopus.com/inward/record.url?scp=85076408198&partnerID=8YFLogxK

U2 - 10.1021/acs.macromol.9b01181

DO - 10.1021/acs.macromol.9b01181

M3 - 文章

AN - SCOPUS:85076408198

SN - 0024-9297

VL - 52

SP - 9321

EP - 9333

JO - Macromolecules

JF - Macromolecules

IS - 23

ER -

Defect Removal by Solvent Vapor Annealing in Thin Films of Lamellar Diblock Copolymers

Abstract

Access to Document

Other files and links

Fingerprint

Cite this